인텔은 올 여름에 LGA2066 HEDT 플랫폼을 리프레쉬 할 것인가?



Intel is rumored to refresh its high-end desktop (HEDT) platforms this Summer with new products based on the 'Cascade Lake' microarchitecture. Intel now has two HEDT platforms, LGA2066 and LGA3647. The new 'Cascade Lake-X' silicon will target the LGA2066 platform, and could see the light of the day by June, on the sidelines of Computex 2019. A higher core-count model with 6-channel memory, will be launched for the LGA3647 socket as early as April. So if you've very recently fronted $3,000 on a Xeon W-3175X, here's a bucket of remorse. Both chips will be built on existing 14 nm process, and will bring innovations such as Optane Persistent Memory support, Intel Deep Learning Boost (DLBOOST) extensions with VNNI instruction-set, and hardware mitigation against more variants of 'Meltdown' and 'Spectre.'

2018 년 11 월부터 LGA1151 플랫폼의 10 코어 실리콘 인 Comet Lake가 존재하고 기존에 구축 된 또 하나의 'Skylake'파생물 인 'Comet Lake'가 존재한다는 사실을 업계의 다른 곳에서 인텔과 고수했습니다. 14 nm 공정. 이 칩은 실제 칩이며 코어 수가 12-16 개인 AMD 최초의 7nm 'Zen 2'소켓 AM4 프로세서에 대한 인텔의 마지막 방어선이 될 것입니다. Sources: momomo_us (Twitter), ChipHell